Layer: 8L ENIG Through-hole PCB
Material: KB6167 (TG 170)
Finished Thickness: 1.6mm ±0.1mm
Min. Via: 0.15mm
Aspect Ratio: 1:11
Min. Line Width/Spacing: 75μm / 75μm
Min. Pad Size: 0.2mm
Solder Mask & Silkscreen Color: Matte Black / White
ENIG Thickness: 0.05μm
Special Process: High aspect ratio vias, fine-line routing
