6-layer ENIG PCB applied in embedded automotive multimedia control motherboards
Layer: 6L ENIG Through-hole PCB
Material: Shengyi S1000-2 (TG 180)
Finished Thickness: 1.6mm ±0.1mm
Min. Via: 0.2mm
Aspect Ratio: 1:8
Min. Line Width/Spacing: 100μm / 75μm
Min. Pad Size: 0.25mm
Solder Mask & Silkscreen Color: Photosensitive Green / White
ENIG Thickness: 0.075μm
Special Process: Resin plug via + plated surface filling
