High-frequency and high-speed hybrid printed circuit boards are engineered for superior signal integrity and performance. Widely used in the communications industry.
Layer: 4L, ENIG (Electroless Nickel Immersion Gold) High-Frequency & High-Speed Hybrid PCB
Material: RO4350B + TU768
Finished Thickness: 1.6 mm ± 0.1 mm
Minimum Via Hole Size: 0.25 mm
Minimum Line Width / Spacing: 100 μm / 100 μm
Solder Mask & Legend Color: Photoimageable Green / White
Gold Plating Thickness: 0.05 μm
Special Process: Hybrid lamination of high-frequency and high-speed materials
