Layer: 10L ENIG 2-step HDI
Material: Shengyi S1000-2M
Finished Thickness: 1.6 mm ± 0.1 mm
Minimum Via: Laser via: 0.1 mm, Mechanical via: 0.15 mm
Minimum Trace/Space: 75 µm / 50 µm
Minimum Pad: 0.2 mm
Solder Mask & Legend Color: Matte Black / White
ENIG Thickness: 0.05 µm
Special Process: Fine line + Multiple laminations + Resin-filled vias + Plated-through holes
