10-Layer 1-Step HDI PCB with Dual Process 10-Layer 1-Step HDI PCB with Dual Process

10-Layer 1-Step HDI PCB is engineered for high-performance industrial control applications.

Share this:

Product Description

Layer: 10L, 1-Step HDI PCB

Material: Shengyi S1000-2M

Finished Thickness: 1.2 mm ± 0.1 mm

Minimum Via Hole Size: Laser Via: 0.1 mm; Mechanical Via: 0.2 mm

Minimum Line Width / Spacing: 75 μm / 75 μm

Minimum Pad Size: 0.2 mm

Solder Mask & Legend Color: Matte Black / White

Surface Finish: OSP + ENIG 0.05 μm

Special Process: Multiple lamination, resin via plugging, via filling & plating, dual surface finishing

 

One-stop PCBA manufacturing service.
×

Contact Us

captcha
×

Inquire

*Name
*Email
Company Name
Tel
*Message