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HDI (High-Density Interconnect) PCBs use laser drilling and blind via technology to achieve high routing density. These boards are widely used in smartphones, tablets, medical devices, and automotive electronics.
Key features of HDI boards:
* Laser-drilled vias as small as 0.075mm
* Stacked and any-layer via structures supported
* Low-loss, low-absorption materials (e.g., Rogers 4000, Isola 370HR)
* Compact SMT pad designs for BGA and CSP components
Jingweixin supports stable mass production of 1st and 2nd-order HDI boards. Contact us for a quote!