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With the increasing need for compact and high-density electronics, multilayer PCBs are widely used. The lamination process is key to ensuring board reliability and consistency.
Jingweixin ensures optimal lamination through:
* Vacuum lamination to avoid delamination
* High Tg prepreg for thermal stability
* Tight layer alignment tolerance (within ±75μm)
* Thermal stress testing and X-RAY layer registration check
We support up to 20-layer multilayer PCBs. Send us your Gerber files for a fast quote!