Layer: 2L ENIG Through-hole PCB
Material: KB6160 TG135
Finished Thickness: 1.6mm ±0.1mm
Min. Via: 0.25mm
Min. Line Width/Spacing: 100μm / 100μm
Min. Pad Size: 0.3mm
Solder Mask & Silkscreen Color: custom blue / white
ENIG Thickness: 0.025μm
Special Process: custom ink + tight tolerance control for multiple slot holes
